Å·ÃÀAV

Soft matter lies at the intersection of physics, chemistry, and biology, underpinning advances in drug delivery, responsive materials, and sustainable polymers. Yet fundamental questions persist, what governs self-assembly across length scales? How do microstructure and dynamics determine macroscopic properties? How can rheology, scattering, and simulation jointly guide materials design? This meeting is a half-day symposium designed to address these challenges by uniting the soft matter, characterization, and theory communities.

The symposium will feature lectures by Professor Michael Rubinstein (Duke University), Dr Amelia Liu (University of Kent, UK), Professor Gerald G. Fuller, Stanford University alongside invited talks from Indian Institute of Technology Bombay, and University of Birmingham. The program spans polymers, gels, colloids, and biological soft matter, with emphasis on in situ characterization, self-assembly mechanisms, and simulation-driven structure–property insights.

The day will conclude with a session from Dr Kay Burrows (Deputy Editor, Å·ÃÀAV, UK) who would introduce the portfolio of journals relevant to the soft matter community. She will walk attendees through the scope and focus areas of key Å·ÃÀAV titles, highlight emerging trends shaping editorial priorities, and offer practical guidance on publishing expectations. She would also briefly discuss the use of AI in manuscripts.

Don’t miss this exciting opportunity to meet, learn, and interact with the Å·ÃÀAV team, editorial board members, and international experts

​Mark your calendar for this event on Monday, 1^st June 2026 at IIT Bombay, India.

Block your seat now – registration is free!

Please note participants must make their own travel arrangements for the event. ​â¶Ä‹

Topics to be covered:

​Engaging insights and scientific advancements shared by our speakers on the themes including soft matter, polymeric theory and simulations, disordered materials characterization, fluid mechanics and Å·ÃÀAV journals on scope, trends, and publishing expectations. and many more.

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